Method of molding a header of an implantable pulse generator
US10850106B2 · kind B2 · utility
0Cited by
19References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2017 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Nov 14, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4922
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An implantable pulse generator includes a device housing containing pulse generator circuitry and a header molded to the device housing. The header can be formed of an epoxy header material. A header component can have a first part molded in the header material to fix the header component to the header at a surface of the header and a second part extending out of the header material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.