Epoxy (meth) acrylate compound and curable composition containing same
US10851199B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2017 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Nov 19, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy (meth)acrylate compound represented by general formula (1): where at least one of R1 to R5 has a structure represented by formula (2): * denotes the bonding position to a carbon atom that constitutes the benzene ring to which R1 to R5 are bonded in formula (1), R7 denotes a hydrogen atom or a methyl group, the remainder of R1 to R5 are each independently selected from the group consisting of hydrogen atoms, alkyl groups and alkoxy groups having 1-6 carbon atoms, and R6 denotes a hydrogen atom or a methyl group. In the epoxy (meth)acrylate compound, the content of halogen atoms is 100 ppm by mass or less. A curable composition for forming a protective film for an electrically conductive pattern obtained by mixing the epoxy (meth)acrylate compound with a photopolymerization initiator and at least one type of monomer or oligomer that contains a (meth)acryloyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.