Highly filled high thermal conductive material, method for manufacturing same, composition, coating liquid and molded article
US10851277B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2019 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Feb 24, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
[Problem] Provided are a high filler-loaded high thermal conductive material which sufficiently utilizes features of an organic polymer while ameliorating drawbacks, enables integrated molding with ceramics, metals, semiconductor elements and the like, and has a low coefficient of thermal expansion and a high thermal conductivity; and a method for producing the high filler-loaded high thermal conductive material, a composition, coating liquid and a molded article.[Solution] Disclosed is a high filler-loaded high thermal conductive material formed by subjecting a composition which includes organic polymer particles and a thermally conductive filler having a graphite-like structure, and includes 5 to 60% by weight of the organic polymer particles and 40 to 95% by weight of the thermally conductive filler having a graphite-like structure relative to 100% by weight of the total amount of these components, is obtained, so that the thermally conductive filler is dispersed by delamination while maintaining the average planar particle size of the thermally conductive filler, and is capable of forming a thermally conductive infinite cluster; to press molding at a temperature higher than equ…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.