Techniques to combine two integrated photonic substrates
US10852492B1 · kind B1 · utility
37Cited by
55References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2015 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Oct 29, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12147
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Structures and methods for passively aligning a photonic die with a receiving substrate are described. Three alignment surfaces, having dimensions greater than a desired alignment accuracy, may be formed on the photonic die and used to passively and accurately align the photonic die to a receiving substrate in six degrees of freedom. Two of the three alignment surfaces on the photonic die may be formed in a single mask-and-etch process, while the third alignment surface may require no patterning or etching. Three complementary alignment surfaces on the receiving substrate may be formed in a single mask-and-etch process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.