Print substrate surface modification
US10852680B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2015 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Jun 30, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03G2215/00801
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
There is provided a method and apparatus for preparing a print substrate. A surface resistivity of a print substrate comprising a conductive layer is determined. The determined surface resistivity is compared to a print range having a lower threshold value for the surface resistivity of the print substrate and an upper threshold value for the surface resistivity of the print substrate. If the determined resistivity of the print substrate is outside the print range, a surface modification is selected to adjust the determined surface resistivity of the print substrate to fall within the print range. The selected surface modification is applied to the top layer of the print substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.