Power efficient, dynamic management of haptic module mechanical offset
US10852830B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2018 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Sep 11, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG08B6/00
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
In an embodiment, a method comprises: receiving, by a mechanical offset controller, input data; detecting, by the mechanical offset controller, a waveform command in the input data; responsive to the detecting, generating, by the mechanical offset controller, an unparking command; receiving, by a closed-loop controller, the unparking command; and moving, by the closed-loop controller, a mass in a haptic module from a mechanical resting position to a sensor reference position in accordance with the unparking command. The method further comprises: detecting, by the mechanical offset controller, that the input data does not include the waveform command; responsive to the detecting, generating, by the mechanical offset controller, a parking command; receiving, by a closed-loop controller, the parking command; and moving, by the closed-loop controller, the mass in the haptic module from the sensor reference position to the mechanical resting position in accordance with the parking command.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.