Ultra-thin touch panel and method of fabricating the same
US10852891B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2018 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Sep 6, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04808
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are an ultra-thin touch panel and a method of fabricating the same. Particularly, the ultra-thin touch panel according to an embodiment of the present disclosure includes a flexible substrate, a plurality of first sensing electrodes arranged in a first direction on the flexible substrate, an adhesive insulating layer formed on the flexible substrate and the first sensing electrodes, and a plurality of second sensing electrodes arranged in a second direction, which intersects the first direction, on the flexible substrate and the adhesive insulating layer using a wet transfer method, wherein the flexible substrate is patterned in a shape corresponding to the first and second sensing electrodes by oxygen plasma etching to form a polygonal mesh structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.