Magnetron, magnetron sputtering chamber, and magnetron sputtering apparatus
US10854434B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2019 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Apr 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Magnetron, magnetron sputtering chamber, and magnetron sputtering apparatus are provided. The magnetron has a rotation center, and includes a first outer magnetic pole and a first inner magnetic pole of opposite polarities. The first outer magnetic pole has an annular structure around the rotation center. The first inner magnetic pole is located on the inner side of the first outer magnetic pole, and a first magnetic field track is formed between the first inner magnetic pole and the first outer magnetic pole. A straight line starting from the rotation center and along one of the radial directions passes through the first magnetic field track at least twice in succession, and the magnetic-field directions at the two positions of the first magnetic field track that the straight line passes through twice in succession are opposite to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.