Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
US10854495B2 · kind B2 · utility
3Cited by
2References
11Claims
0Family size
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Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6834
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.