Semiconductor package including organic interposer
US10854528B2 · kind B2 · utility
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3References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 17, 2020 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Jan 17, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer electrically connected to the connection pads; barrier layers disposed on side surfaces of the first and second semiconductor chips; and an encapsulant encapsulating at least portions of the first and second semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.