Method and device for transferring electronic components between substrates

US10854775B2 · kind B2 · utility

Assignee

• Mühlbauer GmbH & Co. KG · DE

Inventors

• Klaus Schlemper · Dresden, DE
• Hans-Peter Monser · Dresden, DE
• Sigmund Niklas · Monsheim, DE

Key dates

• Filing date: Sep 26, 2017
• Grant date: Dec 1, 2020
• Expiry date: Sep 26, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2221/68381
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and a device for carrying out the method for transferring electronic components from a carrier substrate to a receiving substrate. The method comprises a positioning step in which a carrier substrate on which a plurality of electronic components arranged in a grid each adhere to a corresponding adhesion site by means of an adhesion which can be detached by laser radiation is positioned, in particular oriented, relative to a receiving substrate; a transferring step in which, while the positioning of the carrier substrate relative to the receiving substrate is maintained, the adhesion sites of the components of a transfer unit consisting of at least two of the components arranged on the carrier substrate are selectively irradiated with laser radiation such that the adhesion of the components of the transfer unit is selectively detached thereby from the carrier substrate at these adhesion sites, and the components of the transfer unit are each transferred to a grid position on the receiving substrate corresponding to the initial arrangement thereof in the grid on the carrier substrate.