Method for producing an optoelectronic component and optoelectronic component

US10854793B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• David Racz · Regensburg, DE
• Matthias Sperl · Mintraching, DE

Key dates

• Filing date: May 10, 2017
• Grant date: Dec 1, 2020
• Expiry date: May 19, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/882

Abstract

An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment a method includes providing at least one light-emitting semiconductor chip comprising a sapphire substrate and an epitaxially grown layer sequence, arranging the light-emitting semiconductor chip with a side facing away from the sapphire substrate on a carrier, detaching the sapphire substrate from the semiconductor chip, applying a converter element on a region of the semiconductor chip in which the sapphire substrate was detached, arranging the semiconductor chip on an auxiliary carrier so that the converter element faces the auxiliary carrier and detaching the carrier from the semiconductor chip.