Bonding strategies for placement of LEDs from multiple carrier substrates
US10854801B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2018 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Apr 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for directly bonding semiconductor devices from multiple carrier substrates to a target substrate using relative alignments of semiconductor contacts to substrate contacts, as well as relative heights of semiconductor contacts to substrate contacts. The method may include directly bonding a subset of semiconductor devices on a first carrier substrate with a first alignment to a subset of substrate contacts, and directly bonding a subset of second semiconductor device on a second carrier substrate with a second alignment to a subset of substrate contacts. The method may include directly bonding a subset of semiconductor devices with a first height on a first carrier substrate to a first subset of substrate contacts, followed by directly bonding a second subset of second semiconductor devices with a second height on a second carrier substrate to a second subset of substrate contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.