3D electromagnetic bandgap circuit
US10856405B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2019 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Jul 31, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0233
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A 3D electromagnetic bandgap circuit includes: a dielectric layer having a first surface and an opposing second surface; a spiral element positioned on the first surface; a first surrounding element positioned on the first surface and surrounding the spiral element, but does not touch with the spiral element; a plane element positioned on the second surface and including a notch; a second surrounding element positioned on the second surface and surrounding the plane element, but does not touch with the plane element, wherein the second surrounding element further includes a protruding portion extending toward the notch; a first via passing through the dielectric layer, the spiral element, and the protruding portion; a second via passing through the dielectric layer, the plane element, and the first surrounding element; and a third via passing through the dielectric layer, the plane element, and the first surrounding element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.