Segmented stretchable/conformable electronic and optoelectronic circuit on stretchable backplane
US10856413B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2018 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Apr 9, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fabrication method for stretchable/conformable electronic and optoelectronic circuits and the resulting circuits. The method may utilize a variety of electronic materials including, but not limited to Silicon, GaAs, InSb, PbSe, CdTe, organic semiconductors, metal oxide semiconductors and related alloys or hybrid combinations of the aforementioned materials. While a wide range of fabricated electronic/optoelectronic devices, circuits, and systems could be manufactured using the embodied technology, a hemispherical image sensor is an exemplary advantageous optoelectronic device that is enabled by this technology. Other applications include but are not limited to wearable electronics, flexible devices for the internet-of-things, and advanced imaging systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.