Method of forming pattern on a substrate
US10856422B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2016 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | Sep 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Method of forming a pattern by arranging a photocurable composition on a substrate; bringing a mold having a concavo-convex pattern into contact with the composition; irradiating the composition with light to form a cured film; releasing the mold from the cured film; forming a reversal layer on the cured film having a concavo-convex pattern transferred from the mold; partially removing the reversal layer to expose the convexes of the pattern in such a manner that the reversal layer remains in the concaves of the pattern formed on the cured film; and etching the photocurable composition layer using the reversal layer remaining in the concaves as a mask to form a reversal pattern, wherein the mold is brought into contact with the photocurable composition in an atmosphere of a soluble gas having a solubility in the composition; and the soluble gas has a saturation solubility of 38% by volume or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.