Patent · US Active

Apparatus and method for cooling an electronic assembly

US10856440B2 · kind B2 · utility

0Cited by

3References

9Claims

0Family size

Assignee

HENSOLDT SENSORS GmbH · DE

Inventors

Joerg Sander · Ulm, DE
Tim Moser · Cambridge, US

Key dates

Filing date	Sep 6, 2019
Grant date	Dec 1, 2020
Priority date	—
Expiry date	Sep 6, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/20936
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

An apparatus configured to cool an electronic assembly includes an evaporator configured to evaporate a cooling medium using heat of the electronic assembly, and a power transformer configured to transform energy stored in the evaporated cooling medium into electric power. The cooling medium has an evaporating temperature at atmospheric pressure within a temperature range of 50° C. to 80° C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.