Cladded metal structures for dissipation of heat in a portable electronic device
US10856443B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2019 |
| Grant date | Dec 1, 2020 |
| Priority date | — |
| Expiry date | May 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/205
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.