Flexible hermetic membranes with electrically conducting vias
US10857368B2 · kind B2 · utility
1Cited by
16References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Mar 2, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed herein are electrically conductive and hermetic vias disposed within an insulator substrate of a feedthrough assembly and methods for making and using the same. Such aspects of the present invention consequently provide for the miniaturization of feedthrough assemblies inasmuch as the feedthrough components of the present invention are capable of supporting very small and hermetic conductively filled via holes in the absence of additional components, such as, for example, terminal pins, leadwires, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.