Patent · US Active

Method for structuring a substrate surface

US10857622B2 · kind B2 · utility

0Cited by
3References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 13, 2018
Grant dateDec 8, 2020
Priority date
Expiry dateJun 13, 2038

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K2103/16
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method for generating a structured surface on a substrate includes analyzing a substrate surface of the substrate and selecting, as a function of a condition of the substrate surface, method parameters including focus diameter, pulse peak power, pulse energy, point spacing, pulse length, pulse spacing and/or pulse sequence. The method further includes generating, by partial ablation and partial deposition via treatment with an intensive pulsed laser beam, surface structures having dimensions in the sub-micrometer range such that a multi-scale surface structure in the sub-micrometer and micrometer range adapted to intrinsically inhomogeneous properties of the substrate surface in the sub-micrometer range is generated. The substrate is an inhomogeneous substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.