Interlayered structures for joining dissimilar materials and methods for joining dissimilar metals
US10857628B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 6, 2017 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Apr 23, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An interlayered structure for joining of dissimilar materials includes: a first material substrate; a second material substrate having a composition dissimilar from a composition of the first material substrate; and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.