Building board and method of forming the building board
US10857770B2 · kind B2 · utility
0Cited by
28References
18Claims
0Family size
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Key dates
| Filing date | Mar 31, 2017 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Mar 31, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02W30/91
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A building board including a cementitious layer between two fiber mats. At least one fiber mat forms with a polymer film a fiber mat/polymer film laminate. The cementitious layer of the building board contains a reactive water-insoluble polymer which improves binding of the fiber mat/polymer film laminate to the cementitious layer. The building board has a low water absorption and a high level surface finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.