Mini light emitting diode backlight module and manufacturing method of fluorescent film layer
US10859240B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 24, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | May 5, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133614
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed is a mini light emitting diode backlight module, comprising a light emitting diode light source and a fluorescent film layer, wherein the light emitting diode light source comprises a substrate and mini light emitting diode lamp beads arranged in an array on the substrate, and the fluorescent film layer is disposed in a light emitting direction of the light emitting diode light source, and a surface of the fluorescent film layer toward the mini light emitting diode lamp beads is provided with grooves arranged in an array. By designing the fluorescent film layer having a specific shape, and placing the same in front of the mini light emitting diode lamp beads, the light leakage can be avoided and the light path can be changed to solve the problem of hotspot and light leakage around in the mini light emitting diode backlight module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.