Thermal pile sensing structure integrated with capacitor
US10859442B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 4, 2019 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Jul 4, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention discloses a thermal pile sensing structure integrated with one or more capacitors, which includes: a substrate, an infrared sensing unit and a partition structure. The infrared sensing unit includes a first and a second sensing structure. A hot junction is formed between the first and the second sensing structures at a location where the first and the second sensing structures are close to each other. A cold junction is formed between the partition structure and the first sensing structure at a location where these two structures are close to each other. Another cold junction is formed between the partition structure and the second sensing structure at a location where these two structures are close to each other. A temperature difference between the hot junction and the cold junction generates a voltage difference signal. Apart of the partition structure forms at least one capacitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.