Transfer printing substrate and method for producing the same
US10861356B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Jan 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/01
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a transfer printing substrate and a method for producing the same, in order to improve yield of picking up of the micro-components and further improve quality of image display. The transfer printing substrate includes a carrying substrate, a plurality of supporting structures, and a plurality of micro-components corresponding to the plurality of support structures in one-to-one correspondence, wherein each of the plurality of supporting structures includes a fixing part and a suspended supporting part, wherein an end of the fixing part is fixed on the carrying substrate, an end of the suspended supporting part is connected to the fixing part, the other end of the suspended supporting part supports a corresponding one of the plurality of micro-components, and a first moving space is provided between the suspended supporting part and the carrying substrate. The transfer printing substrate is used for transferring the micro-components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.