Patent · US Active

Electronic module including encapsulation enabling electrical contact therethrough

US10861762B2 · kind B2 · utility

1Cited by

1References

11Claims

0Family size

Assignee

Endress+Hauser SE+Co. KG · DE

Inventors

Bernd Strütt · Steinen, DE
Christian Strittmatter · Geislehen, DE
Simon Gerwig · Schopfheim, DE
Thorsten Siedler · Birsfelden, CH
Ralf Leisinger · Wieslet, DE

Key dates

Filing date	Oct 30, 2017
Grant date	Dec 8, 2020
Priority date	—
Expiry date	Oct 30, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/162
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The present disclosure relates to an explosion resistant electronic module having a high-speed interface and a method for electronic contacting of such electronic module via such interface. The electronic module includes an electronic component, an electrical contact area for electrical contacting the electronic component and an encapsulation, which encapsulates at least the electrical contact area. The encapsulation is embodied such that the contact area is contactable through the encapsulation by an electrical contact pin, wherein the encapsulation is filled at least in a portion with a self-healing gelatinous potting compound, which enables the encapsulation to be re-sealed after removal of the contact pin.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.