Microphone assembly for echo rejection in audio endpoints
US10863035B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2017 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Jun 25, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R27/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Presented herein is an audio endpoint for telecommunication operations with increased echo rejection. According to one example, the audio endpoint includes a housing body, an upper speaker assembly, a lower speaker assembly, and at least one microphone assembly. The upper speaker assembly is disposed near a top portion of the housing body and has an effective frequency range above a first frequency. The lower speaker assembly is disposed near a bottom portion of the housing body and has an effective frequency range below a second frequency. The microphone assembly includes a first microphone element and a second microphone element. The first microphone element is above the second microphone element so that they are vertically aligned. The first microphone element has an effective frequency range below the first frequency and the second microphone element has an effective frequency range above the second frequency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.