Patent · US Active

Circuit configuration for controlling a power semiconductor device with two circuit carriers and a plastic molded body and arrangement having said configuration

US10863623B2 · kind B2 · utility

0Cited by

1References

6Claims

0Family size

Assignee

SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

Nicola Burani · Nuremberg, DE
Roland Bittner · Ansbach, DE
Matthias Kujath · Nuremberg, DE
Peter Mauer · Fürth, DE

Key dates

Filing date	Mar 27, 2019
Grant date	Dec 8, 2020
Priority date	—
Expiry date	Mar 27, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10121
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A circuit configuration for controlling a power semiconductor device has a first circuit carrier and a second circuit carrier arranged parallel to and spaced apart from the first, and having a plastic molded body arranged in an intermediate space between the first and second circuit carrier, wherein the first circuit carrier has a first conductor track with a first contact point, which can be implemented in particular as a contact pad or as a contact receptacle, which is arranged on a main side of the first circuit carrier facing the plastic molded body, wherein the second circuit carrier has a second conductor track with a second contact point, which is arranged on a main side of the second circuit carrier facing the plastic molded body, wherein the plastic molded body has a first holder for a first component with a first and a second contact device, and wherein the first contact device is electrically conductively connected to the first contact point and the second contact device is electrically conductively connected to the second contact point.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.