Method for manufacturing electronic device
US10863636B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 29, 2018 |
| Grant date | Dec 8, 2020 |
| Priority date | — |
| Expiry date | Aug 14, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D5/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an electronic device is disclosed. In the method, a first shell and a second shell are formed. The first shell and the second shell are assembled with each other to form a casing for receiving an electronic module. The two opposite ends of the casing respectively have a first opening and a second opening. The first opening and the second opening are aligned with each other along an extending direction. A seam is located at an outer surface of the casing and between the first shell and the second shell. A paint level is formed on the outer surface of the casing to cover the seam. The casing is moved toward a water transferring film along the extending direction which is vertical to the water transferring film for connecting the water transferring film with the paint level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.