Location of image plane in a laser processing system
US10864599B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2017 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Sep 19, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/384
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Disclosed is a method and an apparatus to process a workpiece including producing a first beam of laser energy characterized by a first spatial intensity distribution. A first workpiece is processed using the first beam of laser energy to form a plurality of features at a first distance between the scan lens and the first workpiece and forming a second features at a second distance. The method includes determining which of the plurality of features has a shape that most closely resembles the shape of the first spatial intensity distribution and setting a process distance as the distance that produced that feature. Using this process distance, a surface of a second workpiece is processed using second beam of laser energy with a second spatial intensity distribution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.