Laser processing machine

US10864604B2 · kind B2 · utility

Assignee

• TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

• Philipp Matt · Schwieberdingen, DE
• Thomas Haeberle · Lorsch, DE
• Florian Jarsch · Ditzingen, DE
• Karsten Ruetz · Ludwigsburg, DE

Key dates

• Filing date: Sep 14, 2018
• Grant date: Dec 15, 2020
• Expiry date: May 11, 2039

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/38
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A laser processing machine has a processing area and a laser processing device. A workpiece can be processed by the laser processing device at a processing location via emission of laser radiation to generate a processing product. An environment of the processing area is shielded against the laser radiation by a protective housing. The processing product can be moved in a discharge direction to pass a boundary of the protective housing that is flexible in the discharge direction. A product rest, arranged below the processing location in the vertical direction and extending in the discharge direction, functions to store the processing product. In the vertical direction below the processing location, the protective housing extends in the discharge direction, forming an extension with which the protective housing extends over the product rest. The boundary limits the extension in the discharge direction and is arranged above the product rest.