Molded product
US10864704B2 · kind B2 · utility
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9Claims
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Inventors
Key dates
| Filing date | Jun 28, 2019 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24851
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A molded product includes a body including a flat part and a projection protruding from the flat part, a design member including a design surface, and an adhesive member sticking the design member to the body. The adhesive member includes a buffer portion formed by cutting off a part of the adhesive member at a position corresponding at least to the projection. Thus, the adhesive member negates differences in level on the body, allowing the design surface to be smooth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.