Inkjet printhead with encapsulant-retaining features
US10864733B2 · kind B2 · utility
0Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2019 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | May 1, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/052
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A MEMS chip assembly including: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, each MEMS chip having an active surface including one or more MEMS devices and a plurality of bond pads disposed alongside a connection edge of the MEMS chip; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has encapsulant-retaining trenches defined in the active surface extending alongside the connection edge, each encapsulant-retaining trench being disposed between the bond pads and the MEMS devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.