Method of manufacturing light emitting module and light emitting module
US10866456B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 16, 2018 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Feb 16, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8514
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A light emitting module with a reduced thickness is provided.A method of manufacturing a light emitting module sequentially includes: providing a light guiding plate having a first main surface being a light emitting surface, and a second main surface on the side opposite to the first main surface; providing a plurality of light emitting elements on the light guiding plate; and forming a wiring electrically connecting the plurality of light emitting elements. A light emitting module includes: a light guiding plate having a first main surface and a second main surface; a plurality of wavelength conversion parts disposed at the second main surface of the light guiding plate so as to be spaced apart from each other; a plurality of light emitting elements respectively bonded to the plurality of wavelength conversion parts; and a wiring connected to the plurality of light emitting elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.