Monolithically integrated wavelength converted photonic integrated circuit (PIC) and hybrid fabrication thereof
US10866487B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2019 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Aug 19, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/377
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A monolithically integrated wavelength converted photonic integrated circuit (PIC) is fabricated by forming a trench in the PIC's insulating layer to expose a portion of an output waveguide that transmits a photonically processed optical signal at frequency ω1. A non-linear waveguide formed of a non-linear material with non-linear susceptibility at frequency ω1 and a transmission bandwidth spanning both ω1 and m*ω1 where m is an integer of at least two is fabricated in direct physical contact with the exposed portion of the output waveguide. A patterned structure is fabricated in or on the non-linear waveguide to enhance non-linear susceptibility to generate an optical signal at frequency m*ω1, which may be emitted directly or coupled to an optical antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.