Film touch sensor and method for fabricating the same
US10866661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2017 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Jan 6, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A film touch sensor includes a separation layer; a protective layer disposed on the separation layer, and an electrode pattern layer which is disposed on the protective layer and includes an insulation layer that is a cured layer of a binder resin including (a-1) a resin in which at least a part of a phenolic hydroxyl group or a carboxyl group is protected with an acid decomposable group, (a-2) an acrylic resin containing an epoxy group, and (a-3) an acrylic resin containing an oxetane group, such that it is possible to suppress thermal damage such as wrinkles, or cracks of the insulation layer, which may occur in high-temperature deposition and annealing processes, and significantly reduce an occurrence rate of cracks during peeling-off the same from a carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.