Force or touch sensing on a mobile device using capacitive or pressure sensing
US10866683B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2019 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Aug 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device includes a housing defining part of an interior volume and an opening to the interior volume; a cover mounted to the housing to cover the opening and further define the interior volume; a display mounted within the interior volume and viewable through the cover; and a system in package (SiP) mounted within the interior volume. The SiP includes a self-capacitance sense pad adjacent a first surface of the SiP; a set of solder structures attached to a second surface of the SiP, the second surface opposite the first surface; and an IC coupled to the self-capacitance sense pad and configured to output, at one or more solder structures in the set of solder structures, a digital value related to a measured capacitance of the self-capacitance sense pad. The SiP is mounted within the interior volume with the first surface positioned closer to the cover than the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.