Fault detection method in semiconductor fabrication
US10867823B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2018 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Oct 23, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fault detection method in a semiconductor fabricating factory is provided. The method includes delivering a test vehicle along a rail to a test region. The method further includes projecting a test signal from a transducer that is positioned on the test vehicle over a check board when the test vehicle is located within the test region. The check board and the test vehicle are arranged along an axis that is parallel to the rail. The method also includes performing an analysis of the test signal projected over the check board. In addition, the method includes issuing a warning alarm when an abnormality is detected based on the analysis result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.