DBC structure using a support incorporating a phase change material
US10867883B2 · kind B2 · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2016 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Oct 14, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
DBC type structure, comprising an insulating support (22) coated with at least one conductive zone (20a) able to receive an electronic device, the conductive zone (20a) being in contact with the support (22), the insulating support incorporating means for thermal smoothing of the heat peak released by the component, these means comprising a cavity filled with a phase change material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.