Enhanced flow boiling heat transfer in microchannels with structured surfaces
US10867887B2 · kind B2 · utility
3Cited by
3References
9Claims
0Family size
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Key dates
| Filing date | Jul 28, 2015 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Jul 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A two-phase microchannel heat sink can be a fluid channel including a bottom wall including a superhydrophilic surface with microstructures and a side wall including a surface that is hydrophobic relative to the superhydrophilic surface of the bottom wall. When heat flux is applied to the fluid channel, a liquid film on the bottom wall is maintained and nucleation of boiling occurs only on the side wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.