Printed extendable sensor system
US10867914B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2019 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Mar 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An extendable sensor system having a lattice topology includes a number of extendable interconnects having one or more electrically-conductive layers alternately sandwiched between two or more dielectric layers, two or more interconnect nodes, each located on the lattice topology and electrically-connected to the extendable interconnects to define a sensor array topology, and one or more sensors. The extendable interconnects are arranged in a serpentine pattern that is configured to be expanded, thereby extending the extendable sensor system. The expanded interconnects define an extended sensor system topology, and is configured to be installed on the surface of an asset. Methods of manufacturing an extendable sensor system are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.