Thermoelectric conversion module and manufacturing method thereof

US10868230B2 · kind B2 · utility

Assignee

• YAMAHA CORPORATION · JP

Inventors

• Yuma Horio · Hamamatsu, JP
• Takahiro Hayashi · Tokyo, JP

Key dates

• Filing date: Aug 31, 2016
• Grant date: Dec 15, 2020
• Expiry date: Mar 14, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N10/853

Abstract

Provided is a thermoelectric conversion module having a high heat resistance. The thermoelectric conversion module includes a first substrate, a second substrate, a thermoelectric element, and a bonding layer. The first substrate includes a first metalized layer. The second substrate includes a second metalized layer which faces the first metalized layer. The thermoelectric element includes a chip formed from a thermoelectric material and is arranged between the first metalized layer and the second metalized layer. The bonding layer is composed of a sintered body of a metallic material of which the average crystal particle diameter is no greater than 20 μm and bonds the first metalized layer and the second metalized layer with the thermoelectric element.