Apparatus for polarizing a semiconductor wafer and method for fabricating a magnetic semiconductor device
US10868241B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | May 16, 2019 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | May 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method for fabricating a magnetic semiconductor device, including receiving a semiconductor wafer, disposing the semiconductor wafer under a first electromagnetic element, wherein the first electromagnetic element comprises a primary dimension and a secondary dimension from a top view perspective, the primary dimension being greater than the secondary dimension, and displacing the semiconductor wafer along a predetermined path along the secondary dimension of the first electromagnetic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.