Circuit board heat dissipation assembly
US10869384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2020 |
| Grant date | Dec 15, 2020 |
| Priority date | — |
| Expiry date | Mar 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board heat dissipation assembly includes a circuit board, a heat sink, a metal back plate, a heat pipe, and a pressing member. The circuit board has a front side and a rear side, and the front side has at least one heat generating area. The heat sink is disposed in the heat generating area. The metal back plate is disposed at a spacing from the rear side of the circuit board. The heat pipe has a first end, a bend segment, and a second end. The first end is connected to the heat sink. The second end is in contact with the metal back plate. The bend segment connects the first end and the second end at a side edge of the circuit board. The pressing member is fixed on the metal back plate and presses the second end onto the metal back plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.