Method for defining a laser tool path
US10870171B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Jun 27, 2018 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Mar 16, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/362
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a method for defining a sequence of relative positionings of a laser head 1 in relation to a part for the machining of a texture etched on the two-dimensional or three-dimensional surface 7 of the part modelled by a 3D meshing, comprising: Open patches whose boundary is affected by the laser ray 2 being defined for any areas which could not be machined from validated closed patches 15. Optionally, the method also comprises a step 400 of merging of the validated closed patches 15 into groups 50 of patches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.