Low heat resistance silicone composition
US10870786B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 30, 2019 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Jun 21, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/025
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A low heat resistance silicone composition, including: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) an α-aluminum oxide powder, α-aluminum oxide having a specific crystal structure and a particle shape with a D/H ratio in the predetermined range when a maximum particle diameter parallel to a hexagonal lattice face of the hexagonal close-packed lattice is taken as D and a particle diameter perpendicular to the hexagonal lattice face is taken as H, and the α-aluminum oxide powder having a specific average particle diameter, a specific content of coarse particles, and a specific purity; and (D) a spherical and/or irregular-shaped zinc oxide powder having a specific average particle diameter, and a specific content of coarse particles, in which the low heat resistance silicone composition has a specific heat conductivity and a specific viscosity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.