Processing device, sputtering device, and collimator
US10870913B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2016 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | May 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/285
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A processing device according to one embodiment includes an object placement unit, a source placement unit, a collimator, and a temperature adjusting unit. The object placement unit is configured to have an object arranged. The object placement unit is configured to have an object placed thereon. The source placement unit is arranged apart from the object placement unit and configured to have a particle source placed thereon, the particle source being capable of ejecting a particle toward the object. The collimator configured to be arranged between the object placement unit and the source placement unit, includes walls, and is provided with through holes formed by the walls and extending a direction from the object placement unit to the source placement unit. The temperature adjusting unit is configured to adjust a temperature of the collimator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.