Patent · US Active

Aluminum-copper connector having a heterostructure, and method for producing the heterostructure

US10870924B2 · kind B2 · utility

0Cited by

11References

3Claims

0Family size

Assignee

Christian-Albrechts-Universitaet zu Kiel · DE

Inventors

Mark-Daniel Gerngross · Kiel, DE
Melike Baytekin-Gerngross · Reutlingen, DE
Juergen Carstensen · Kiel, DE
Rainer Adelung · Kiel, DE

Key dates

Filing date	Jun 3, 2017
Grant date	Dec 22, 2020
Priority date	—
Expiry date	Jun 3, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01R13/03
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A heterostructure comprising at least one first surface containing only copper and at least one second surface, opposite the first surface, containing only aluminium or an aluminium alloy with solid solutions present in the alloy, wherein a. an anchoring layer is arranged between the first and second surfaces, wherein b. each slice plane running perpendicular to the anchoring layer has at least one aluminium or aluminium-alloy island surrounded by copper, and c. at most the aluminium alloy solid solutions which are present in the alloy occur in the anchoring layer. Also, an aluminium-copper connector and a heterostructure production method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.