Patent · US Active

Expansion card assembly

US10871808B2 · kind B2 · utility

1Cited by

5References

14Claims

0Family size

Assignee

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. · US

Inventors

Andrew L. Wiltzius · Fort Collins, US
Robert Ebner · Leonding, AT

Key dates

Filing date	Oct 11, 2016
Grant date	Dec 22, 2020
Priority date	—
Expiry date	Oct 11, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH05K7/20172
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

In an example implementation, an expansion card assembly includes a low-profile expansion card, a card cooler attached to the card to force air over the card, and an airflow guide attachable to the card to direct forced air from the card cooler out of a full-height computer enclosure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.