Method for producing electronic components by means of 3D printing
US10872732B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2017 |
| Grant date | Dec 22, 2020 |
| Priority date | — |
| Expiry date | Sep 4, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for producing an electrical component via a 3D printing includes preparing a first layer which includes a valve metal powder, consolidating at least a portion of the valve metal powder of the first layer via a first selective irradiation with a laser, applying a second layer which includes the valve metal powder to the first layer, consolidating at least a portion of the valve metal powder of the second layer via a second selective irradiation with the laser so as to form a composite of the first layer and of the second layer, applying respective additional layers which include the valve metal powder to the composite, and consolidating at least a portion of the valve metal powder of the respective additional layers via a respective additional selective irradiation with the laser to thereby obtain the electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.