Patent · US Active

Method for producing electronic components by means of 3D printing

US10872732B2 · kind B2 · utility

0Cited by
3References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 4, 2017
Grant dateDec 22, 2020
Priority date
Expiry dateSep 4, 2037

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P10/25
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A method for producing an electrical component via a 3D printing includes preparing a first layer which includes a valve metal powder, consolidating at least a portion of the valve metal powder of the first layer via a first selective irradiation with a laser, applying a second layer which includes the valve metal powder to the first layer, consolidating at least a portion of the valve metal powder of the second layer via a second selective irradiation with the laser so as to form a composite of the first layer and of the second layer, applying respective additional layers which include the valve metal powder to the composite, and consolidating at least a portion of the valve metal powder of the respective additional layers via a respective additional selective irradiation with the laser to thereby obtain the electrical component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.